This product is a circular magnetron ZINC - Zn sputtering target, with a 3'' diameter x 0.25" thickness. It is 99.995% pure.

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ZINC - Zn

Zinc (Zn) is a soft, bluish-silver metal with a density of ~7.14 g/cm³ and a low melting point of 419.5 °C, which makes it relatively easy to machine but sensitive to heat during sputtering. It has good electrical conductivity (5.92 µO·cm) and moderate thermal conductivity (~116 W/m·K). Its hexagonal close-packed (HCP) crystal structure and softness allow for high sputter yields, enabling faster deposition rates compared to many refractory metals.

Applications:
In PVD processes, zinc targets are widely used for producing pure Zn films or reactive compounds such as zinc oxide (ZnO) and zinc nitride (Zn3N2), which are important in transparent conductive coatings, optical layers, corrosion protection, and semiconductor devices. However, zinc readily oxidizes in air, so targets must be stored in dry or inert conditions, and pre-sputtering is necessary to remove surface oxides before deposition.

Due to its low melting point, zinc targets require careful thermal management — typically with efficient cooling, gradual power ramp-up, and controlled power density — to avoid warping, melting, or droplet formation. DC or pulsed DC power is preferred for metallic sputtering, while RF power may be needed for insulating compound deposition. Proper bonding to a backing plate helps improve thermal contact and mechanical stability.

RF Sputtering: Although DC sputtering is preferred, RF sputtering can also be used for certain applications where alternating fields are necessary.
ZnO Thin Films: Transparent conductive oxide (TCO) layers in photovoltaics and displays.
Barrier Coatings: Corrosion protection for steel and other substrates.
Optical Coatings: UV-blocking and antireflective layers.
Semiconductor Layers: In piezoelectric and optoelectronic devices.

Barrier Coatings: Used in corrosion protection for steel and other substrates..

Reactive Deposition:

In oxygen or nitrogen atmospheres, zinc readily forms ZnO or Zn3N2 films, widely used in optoelectronics, transparent conducting coatings, and semiconductors.

Challenges:
Oxidation Sensitivity: Rapidly forms a zinc oxide surface layer when exposed to air, which can influence sputtering start-up and deposition quality.


Summary:
Zinc is an effective sputtering target material when handled with attention to its heat sensitivity and oxidation tendency, offering high deposition rates and versatile film applications.

Notes:
Metallic or elastomer backing plate bonding is recommended for all dielectric target materials because these materials have characteristics which are not amenable to sputtering, such as, brittleness and low thermal conductivity. These targets are most susceptible to thermal shock due to their low thermal conductivity and hence, may require specific power ramp up and ramp down procedures during start up and shut down steps.